Tin Coated/Plated Copper Strip (Copper Strip Tin Coated) for Can Packaging

    Base material thickness: 0.1-0.8 mm


    Reflow Tin Plating: Sn 0.8-2.0 μm


    Base Material: Brass /Bronze /Copper /Lead Frame

Product Detail


Copper strips are tin plated and reflow-processed to improve their properties such as solderability, electric connectivity, and corrosion resistivity. These are highly reliable materials that were reflow processed after being tin-plated to prevent the generation of tin whiskers, which used to be a weakness of tin plating. Their press workability does not change after tin plating and they can be formed into complicated product shapes.

Specifications of Tin Plated Copper Strip


    1) Brass: C2600 C2680 C2801

    2) Bronze:C5102 C5191 C5212 C5210

    3) Copper:C1020 C1100 C1201 C1220

    4) Cu-Fe Lead Frame:C19210 C19400

2.Base Materials: Brass Bronze Copper Cu-Fe Lead Frame

3.Base material thickness: 0.1mm-0.8mm

4.Width: Max. 300mm

5.Coil Weight: Max.2400kg; coil:8kg/mm

6.Pre-plating: Cu:0.4μm-0.6μm

7.Reflow Tin Plating : Sn 0.8μm-2.0μm

8.Standard:JIS H3100 Standard, Meets ROHS requierments 

9.Chemical Composition:

Features of Tin Plated Copper Strip

1) Eliminating detrimental "tin whisker"

2) Improving conductivity

3) Corrosion-resistance

4) Insertion force

5) Malleability fo electrical connectors are additional benefits 

Differences between Hot-dip Process and Reflow process


Packaging of Tin Plated Copper Strip:

Shanghai Metal Products are packed and labeled according to the regulations and customer's requests. Great care is taken to avoid any damage which might be caused during storage or transportation. In addition, clear labels are tagged on the outside of the packages for easy identification of the product I. D. and quality information.

1)Shanghai Metal Standard


Applications of Tin Plated Copper Strip

1) Auto spare parts

2) Lead frames

3) Solar panel battery

4) Electronic devices for the telecommunications

5) Appliance 

6) Connectors

7) Semiconductor 

8) Electromagnetic shielding 

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